Kontron COMe-bCL6 SPECIFICATIONS
- Intel® 8th/9th Generation Core™ series / Xeon® E family with CM246/QM370 PCH
- Up to 128 GByte DDR4 non-ECC/ECC memory
- Optional NVMe SSD onboard
- Industrial grade versions
- Support of Kontron’s Embedded Security Solution (APPROTECT)
The Kontron COMe-bCL6 (R E2S) offers increased performance density together with excellent graphic support on a standardized Type 6 Computer-on-Module based on the COM Express basic form factor.
Through the use of consistent COM Express connectors and feature implementation, the COMe-bCL6 is easily exchangeable and offers the most flexibility for customers designing it into their embedded devices based on individual carrier boards.
Especially the introduction of a hexa core CPU, memory expansion to possible 128GB, additional NVMe SSD onboard and the continuation of the Intel® Optane™ fast memory support for system acceleration shall be a differentiator to former applications.
Kontron COMe-bCL6 Features
| Compliance | COM Express® basic, Pin-out Type 6 |
| Dimensions (H x W x D) | 125 x 95 mm |
| CPU | Intel® Xeon® 8th Gen E-2176M, 6x 2.7 GHz (4.4 GHz), GT2, 45/35 W Intel® Core™ 8th Gen i7-8850H, 6x 2.6 GHz (4.3 GHz), GT2, 45/35 W Intel® Core™ 8th Gen i5-8400H, 4x 2.5 GHz (4.2 GHz), GT2, 45/35 W Intel® Core™ 8th Gen i3-8100H, 4x 3.0 GHz, GT2, 45/35 W Intel® Xeon® 9th Gen E-2276ME (6x 2.8 GHz, GT2, 45W/35W) Intel® Xeon® 9th Gen E-2276ML (6x 2.0 GHz, GT2, 25W) Intel® Xeon® 9th Gen E-2254ME (4x 2.6 GHz, GT2, 45W/35W) Intel® Xeon® 9th Gen E-2254ML (4x 1.7 GHz, GT2, 25W) Intel® Core™ 9th Gen i7-9850HE (6x 2.7 GHz, GT2, 45W/35W) Intel® Core™ 9th Gen i7-9850HL (6x 1.9 GHz, GT2, 25W) Intel® Core™ 9th Gen i3-9100HL (4x 1.6 GHz, GT2, 25W) Intel® Celeron® 9th Gen G4930E (2×2.4 GHz, GT2, 35W) Intel® Celeron® 9th Gen G4932E (2×1.9 GHz, GT2, 25W) |
| Chipset | Intel® Mobile CM246 (Xeon®) / Intel® Mobile QM370 (Core™) |
| Main Memory | Up to 4x DDR4-2666 SO-DIMM with up to 128 GByte (non-ECC/ECC) (3rd/4th socket on request) |
| Graphics Controller | Intel® UHD Graphics P630 for Xeon® processor Intel® UHD Graphics 630 for Core™ processors Intel® UHD Graphics 610 for Celeron® processors |
| Ethernet Controller | Intel® I219LM |
| Ethernet | 10/100/1000 MBit Ethernet |
| Hard Disk | 4x SATA 6Gb/s |
| Flash Onboard | Up to 1 TByte NVMe SSD (on request) |
| PCI Express / PCI support | 8x PCIe x1, 1x PEG x16 |
| Panel signal | DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: -, LVDS: Dual Channel 18/24bit |
| USB | 4x USB 3.1 (incl. USB 2.0) + 4x USB 2.0 |
| Serial | 2x serial interface (RX/TX only |
| Audio | Intel® High Definition Audio |
| Common Features | SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC, support of Intel® Optane™ memory technology via PCIe |
| BIOS | AMI Aptio V |
| Humidity | 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) |
| Options | vPRO (AMT/TXT/AES Support), eDP instead of LVDS, VGA, Intel® Mobile HM370 Chipset, 3rd/4th DDR4 SO-DIMM socket, NVMe SSD |
| Power Management | ACPI 6.0 |
| Power Supply | 8.5 V – 20 V Wide Range, Single Supply Power |
| Special Features | POSCAP capacitors, Trusted Platfom Module TPM 2.0, Security Chip, 4k Resolutions, Flexible PEG lane configuration by Setup Option, Rapid shutdown (R E2S variants) |
| Operating System | Windows® 10, Linux, VxWorks |
| Temperature | Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating Extended temperature: -25 °C to +75 °C operating, -30 °C to +85 °C non-operating Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating |
| Supported Modules | COMe-bCL6(R E2S) xx-xxxxx CM246/QM370 |
