Semtech Releases Indoor Reference Design for Smart Buildings and Homes

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Discover the latest release from Semtech – Indoor Reference Design for Smart Buildings and Homes

[/vc_column_text][/vc_column][/vc_row][vc_row][vc_column][vc_column_text]Semtech Corporation, a leading supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, announced the general availability of the LoRa® Corecell reference design for indoor gateway applications. The reference design is developed to the LoRaWAN protocol and targeted for home, building and factory automation’s.

“The LoRa Corecell reference design’s key features, including low power, smaller package and higher integration with improved performance, aims to eliminate design complexity and accelerate time-to-market in the smart home and building industries” said Pedro Pachuca, Director of IoT for Semtech’s Wireless and Sensing Products group. “As we announced earlier this year, Semtech is committed to developing a LoRa product roadmap that simplifies IoT applications that enable a faster time-to-market for IoT solution providers and systems integrators. This new reference design is key to our LoRa offerings as more real estate and commercial managers, as well as consumers, look for solutions that solve their daily challenges, such as meeting room occupancy and temperature/humidity monitoring.”

The LoRa Corecell reference design provides the “minimum optimised solution” to build a gateway application, which is represented in the name, “core” and “cell.” The reference design is comprised of two new integrated circuits (ICs), LoRa-based gateway baseband transceiver (SX1302) and the low power multi-band Sub-GHz RF Front End (SX1250), enabling customers to deploy cost-effective indoor gateway solutions. The ICs are designed to dramatically reduce power consumption up to one tenth the power legacy products, enabling power constrained USB-based gateways and mobile battery operated gateways. The new products allow for bill of materials (BOM) cost reduction, provide a small package form factor while increasing performance based on a larger number of modulators and demodulators. In addition, spreading factor five and spreading factor six were added to support higher data rates, reducing time on air and power consumption.[/vc_column_text][/vc_column][/vc_row][vc_row][vc_column][vc_separator][/vc_column][/vc_row]